EMC implementation - Raised floors: Difference between revisions
m (moved EMC implementation - False floor to EMC implementation - Raised floors: page name changed according to guide 2013) |
(updated according to guide 2013) |
||
| Line 2: | Line 2: | ||
__TOC__ | __TOC__ | ||
The inclusion of the floors in the mesh contributes to equipotentiality of the area and consequently to the distribution and dilution of disturbing LF currents | The inclusion of the floors in the mesh contributes to equipotentiality of the area and consequently to the distribution and dilution of disturbing LF currents. | ||
-- | The screening effect of a raised floor is directly related to its equipotentiality. If the contact between the floor tiles is poor (rubber antistatic joints, for example) or if the contact between the support brackets is faulty (pollution, corrosion, dust, etc. or if there are no support brackets), it is necessary to add an equipotential mesh. | ||
In this case, it is sufficient to ensure effective electrical connections between the metal pedestals. Small spring clips are available on the market to connect the metal pedestals to the equipotential mesh. Ideally, each pedestal should be connected, but it is often sufficient to connect every other pedestals in each direction. A mesh 1.5 to 2 metres in size is suitable in most cases. The recommended cross-sectional area of the copper is 10 mm<sup>2</sup> or more. In general, a flat braid is used. To reduce the effects of corrosion, it is advised to use tin-plated copper (see '''Fig. R8'''). | |||
Perforated floor tiles act like normal floor tiles when they have a cellular steel structure. | |||
Preventive maintenance is required for the floor tiles approximately every five years (depending on the type of floor tile and the environment, including humidity, dust and corrosion). Rubber or polymer antistatic joints must be maintained, similar to the bearing surfaces of the floor tiles (cleaning with a suitable product). | |||
[[Image:Fig R08.jpg|none|700px]] | |||
'''''Fig. R8:''''' <i>Raised floor implementation</i> | |||
[[ru:Конструктивное исполнение ЭМС - фальшполы]] | [[ru:Конструктивное исполнение ЭМС - фальшполы]] | ||
[[zh:电磁兼容实施 - 活动地板]] | [[zh:电磁兼容实施 - 活动地板]] | ||
Revision as of 12:58, 19 October 2013
The inclusion of the floors in the mesh contributes to equipotentiality of the area and consequently to the distribution and dilution of disturbing LF currents.
The screening effect of a raised floor is directly related to its equipotentiality. If the contact between the floor tiles is poor (rubber antistatic joints, for example) or if the contact between the support brackets is faulty (pollution, corrosion, dust, etc. or if there are no support brackets), it is necessary to add an equipotential mesh.
In this case, it is sufficient to ensure effective electrical connections between the metal pedestals. Small spring clips are available on the market to connect the metal pedestals to the equipotential mesh. Ideally, each pedestal should be connected, but it is often sufficient to connect every other pedestals in each direction. A mesh 1.5 to 2 metres in size is suitable in most cases. The recommended cross-sectional area of the copper is 10 mm2 or more. In general, a flat braid is used. To reduce the effects of corrosion, it is advised to use tin-plated copper (see Fig. R8).
Perforated floor tiles act like normal floor tiles when they have a cellular steel structure.
Preventive maintenance is required for the floor tiles approximately every five years (depending on the type of floor tile and the environment, including humidity, dust and corrosion). Rubber or polymer antistatic joints must be maintained, similar to the bearing surfaces of the floor tiles (cleaning with a suitable product).
Fig. R8: Raised floor implementation
ru:Конструктивное исполнение ЭМС - фальшполы zh:电磁兼容实施 - 活动地板
